├── Containerfile
以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
。同城约会对此有专业解读
Comparison between error-diffusion and ordered dithering using an 8-colour regular palette. Left to right: error-diffusion, ordered.
“There’s a pool, I think, of wannabe buyers who have just been sitting on the sidelines and waiting for rates to come down,” Daniel Seely told WSJ. “If they see a drop from above 6, to having that first number be 5, I think that would bring a lot of people out.”